Thermal Interface Materials
1. Thermal Conductive GreaseDescription:
There are a variety of specifications available with low thermal impedance, low overflow, none-drying, and easy operating. This thermal conductive grease can fill the pores between the heat sink and cooler to remove insulating air gaps. It can also improve heat dissipation performance and extend product life. We also provide epoxy compounds for electronic applications for your reference! Contact us to get more detail!
Cooling modules of CPU, MOS, LED, microprocessor, heat sink, graphic card, power relay, and so on.
Introduction of Thermal Conductive Interface Materials:Exquisite, low-weight, thin, and multi-functionality are the critical tendencies found in the research and development (R&D) of modern electronic products. However, the heat-dissipating efficiency issue may exist in these high-tech products, thereby may cause undesired issues about increases in manufacturing cost and damages in the lifetime of products.
2. Thermal AdhesiveDescription:
It is suitable for heat-sink, brass instrument, aluminum and other metals required good thermal conductivity and adhesion.
Cooling modules of IC, CPU, MOS, LED, heat sink, relay, notebook PC, PC, and so on.
*Needing more information please contact us
|Application||One/ Two Components||Curing Condition||Product Name||Features||TDS Download|
|Thermal conductive grease||One||N/A||TIM-0001、TIM-1101
|Grey and high thermal conductivity.||TIM-3101、TIM-3202||TIM-3101、TIM-3202|
|Thermal adhesive||One||Heat curing||2070-1
|High thermal conductivity.||2070-1||2070-1