1. Thermal Conductive Grease

Description: 
There are a variety of specifications available with low thermal impedance, low overflow, none-drying, and easy operating. This thermal conductive grease can fill the pores between the heat sink and cooler to remove insulating air gaps. It can also improve heat dissipation performance and extend product life. We also provide epoxy compounds for electronic applications for your reference! Contact us to get more detail!

Product Application:
Cooling modules of CPU, MOS, LED, microprocessor, heat sink, graphic card, power relay, and so on.

Introduction of Thermal Conductive Interface Materials:

Exquisite, low-weight, thin, and multi-functionality are the critical tendencies found in the research and development (R&D) of modern electronic products. However, the heat-dissipating efficiency issue may exist in these high-tech products, thereby may cause undesired issues about increases in manufacturing cost and damages in the lifetime of products.

Figure 1 shows the development trend of CPU which increases sequentially the cost of heat sink. Usage of thermal interface material with high thermal conductivity (such as thermal conductive grease) can improve the heat transfer efficiency, decrease the cost of the cooler, reduce power consumption, and extend the products' lifetime.

EPORITE series thermal
conductive grease and thermal adhesive (figure 1) can fill the random pores that exist between the heat sink and cooler (figure 2). They can increase the area of heat conduction and decrease the thermal resistance to reach high efficiency of heat transfer. Using EPORITE thermal interface material is one of the best options to achieve the cost down and elongate the lifetime of products.

2. Thermal Adhesive

Description: 
It is suitable for heat-sink, brass instrument, aluminum and other metals required good thermal conductivity and adhesion.

Product Application:
Cooling modules of IC, CPU, MOS, LED, heat sink, relay, notebook PC, PC, and so on.

Product Sheet
Application One/ Two Components Curing Condition Product Name Features TDS Download
Chinese English
Thermal conductive grease One N/A TIM-0001、TIM-1101、TIM-0002、TIM-003

 

White. TIM-0001
TIM-1101
TIM-0002*
TIM-0003*
TIM-0001,
TIM-1101
TIM-0002*
TIM-0003*
One N/A TIM-2101

 

Grey. TIM-2101 TIM-2101
One N/A TIM-3101、TIM-3111、TIM-3121、TIM-3202

 

Grey and high thermal conductivity. TIM-3101,
TIM-3111*,
TIM-3121*,
TIM-3202*
TIM-3101,
TIM-3111*,
TIM-3121*,
TIM-3202*
Thermal adhesive One Heat curing 2070-1、2073、 2074

 

High thermal conductivity; recommended for adhesion on various electronic parts. 2070-1,
2073,
 
2070-1,
2073,
 
Phase change material One N/A PCM series  

 

PCM series* PCM series*
*Needing more information please contact us