1. Thermal Grease

Description: 
There are variety of specifications available with low thermal impedance, low overflow, none-drying and easy operating.

Product Application:
Cooling modules of CPU, MOS, LED, microprocessor, heat sink, graphic card, power relay, and so on.

Intrduction of Thermal Interface Materials:

Exquisite, low-weight, thin and multi-functionality are the critical tendencies found in the research and development (R&D) of modern electronic products. However, the heat dissipating efficiency issue may exist in these high-tech products, thereby may cause the undesired issues about increases in manufacture cost and damages in lifetime of products.

Figure 1 shows the development trend of CPU which increases sequentially the cost of heat sink. A usage of thermal interface material with high thermal conductivity (such as thermal grease) can improve the heat transfer efficiency, decrease cost of cooler, reduce power consumption and extend products' lifetime.

EPORITE series thermal grease and thermal adhesive (figure 1) can fill the random pores exist between heat sink and cooler (figure 2). They can increase the area of heat conduction and decrease the thermal resistance to reach high efficiency of heat transfer. Using EPORITE thermal interface material is one of the best options to achieve the cost down and elongate lifetime of products.

2. Thermal Adhesive

Description: 
It is suitable for heat-sink, brass instrument, aluminum and other metals required good thermal conductivity and adhesion.

Product Application:
Cooling modules of IC, CPU, MOS, LED, heat sink, relay, notebook PC, PC, and so on.

Product Sheet
Application One/ two components Curing condition Product name Features TDS Download
Chinese English
Thermal grease One N/A TIM-0001、TIM-1101、TIM-0002、TIM-003

 

White. TIM-0001
TIM-1101
TIM-0002*
TIM-0003*
TIM-0001,
TIM-1101
TIM-0002*
TIM-0003*
One N/A TIM-2101

 

Grey. TIM-2101 TIM-2101
One N/A TIM-3101、TIM-3111、TIM-3121、TIM-3202

 

Grey and high thermal conductivity. TIM-3101,
TIM-3111*,
TIM-3121*,
TIM-3202*
TIM-3101,
TIM-3111*,
TIM-3121*,
TIM-3202*
Thermal adhesive One Heat curing 2070-1、2073、 2074

 

High thermal conductivity; recommended for adhesion on various electronic parts. 2070-1,
2073,
 
2070-1,
2073,
 
Phase change material One N/A PCM series  

 

PCM series* PCM series*
*Needing more information please contact us