Thermal Conductive Grease
Description
There are a variety of specifications available with low thermal impedance, low overflow, none-drying, and easy operating. This thermal conductive grease can fill the pores between the heat sink and cooler to remove insulating air gaps. It can also improve heat dissipation performance and extend product life. We also provide epoxy compounds for electronic applications for your reference! Contact us to get more detail!
Product Application
Cooling modules of CPU, MOS, LED, microprocessor, heat sink, graphic card, power relay, and so on.
Introduction of Thermal Conductive Interface Materials
Exquisite, low-weight, thin, and multi-functionality are the critical tendencies found in the research and development (R&D) of modern electronic products. However, the heat-dissipating efficiency issue may exist in these high-tech products, thereby may cause undesired issues about increases in manufacturing cost and damages in the lifetime of products.
EPORITE series thermal conductive grease and thermal adhesive can fill the random pores that exist between the heat sink and cooler . They can increase the area of heat conduction and decrease the thermal resistance to reach high efficiency of heat transfer. Using EPORITE thermal interface material is one of the best options to achieve the cost down and elongate the lifetime of products.
