Epoxy Ink Description Epoxy Ink is suitable for wafer coating with good shelter, chemical resistance, and adhesion. Product Application Touch panel industry, PCB, chip resistor, inductance, IC, D-RAM cover coat, and so on. Product Sheet The table can be scrolled horizontally. ⇔ Application Type One / Two Components Curing Condition Product Name Features TDS Download Chinese English Epoxy Ink Insulation One Heat curing EI-300 series Recommended for chip insulating ink. EI-346-040 EI-346-040 Coverage One Heat curing EI-900 series Recommended for remarking ink. EI-988-1 EI-988-1 Marking One Heat curing EI-M series Recommended for marking ink. EI-M series EI-M series Ink application special resin Cover One Heat curing SI series High temperature curing products are not yellowing with high gloss, L value of up to 90, hardness to 6H, and can wear 350 back. SI series SI series * Needing more information please contact us Share
